Short Title:Semiconductor Materials Characterisation
Full Title:Semiconductor Materials Characterisation
Module Code:SEMT H4003
 
Credits: 5
Field of Study:Electronics and automation
Module Delivered in 2 programme(s)
Reviewed By:JAMES WRIGHT
Module Author:JAMES WRIGHT
Module Description:This subject aims to introduce the student to the range of popular instrumentation used for analyzing structure and composition of modern semiconductor devices and materials.
Learning Outcomes
On successful completion of this module the learner will be able to:
LO1 Describe the chemical structure and microstructure of elemental, ceramic and polymeric semiconductor materials relevant to current and emerging technologies.
LO2 Evaluate the capabilities and limitations of the range of materials characterisation techniques listed in the syllabus. (FTIR,SEM, TEM, XES, XPS, AES, SIMS, XRD, SE, SPM, LEED, PALS, XRR.
LO3 Propose and argue the merits of an appropriate technique for meeting a specific materials characterisation objective.
LO4 Analyse the data output from the above instrumentation, correlate outout from a selection of techniques and interpret it and present findings in written and oral form.
LO5 Link microstructure of semiconductor materials to important functional properties (e.g. density,dielectric constant, thermal conductivity, absorption coefficient).
 

Module Content & Assessment

Course Work
Assessment Type Assessment Description Outcome addressed % of total Assessment Date
Practical/Skills Evaluation Specimen preparation for SEM analysis. 2,3,4 10.00 Week 2
Practical/Skills Evaluation Structural and compositional analysis of devices using SEM and EDX. 1,2,3,4 10.00 Week 4
Practical/Skills Evaluation Measurement of thickness and density of thin dielectric layers using XRR and ellipsometry. 1,2,3,4 10.00 Week 4
Practical/Skills Evaluation AFM - like examination of surface roughness of thin films using SEM images and MeX software. 1,2,3,4 10.00 Week 7
End of Module Formal Examination
Assessment Type Assessment Description Outcome addressed % of total Assessment Date
Formal Exam End-of-Semester Final Examination 1,2,3,4,5 60.00 End-of-Semester

TU Dublin – Tallaght Campus reserves the right to alter the nature and timings of assessment

 

Module Workload

Workload: Full Time
Workload Type Workload Description Hours Frequency Average Weekly Learner Workload
Lecture PowerPoint presentation and class discussion 3.00 Every Week 3.00
Lab Sample preparation, imaging, data acquisition and analysis. 1.00 Every Week 1.00
Total Weekly Learner Workload 4.00
Total Weekly Contact Hours 4.00
Workload: Part Time
Workload Type Workload Description Hours Frequency Average Weekly Learner Workload
Lecture No Description 3.00 Every Week 3.00
Lab Writing lab reports. 2.00 Every Week 2.00
Total Weekly Learner Workload 5.00
Total Weekly Contact Hours 5.00
 

Module Resources

Recommended Book Resources
  • David Brandon and Wayne D. Kaplan, Microstructural characterization of materials [ISBN: 0-471-985023]
  • Yale E, Brundle R & Evans C 2010, Characterisation in Silicon Processing, 1 Ed., Momentum Press [ISBN: 978-1606501092]
  • edited by Mikhail Baklanov, Martin Green, and Karen Maex, Dielectric films for advanced microelectronics [ISBN: 978-0470013601]
  • edited by Lawrence C. Wagner 1999, Failure analysis of integrated circuits, Kluwer Academic Publishers Boston, Mass. [ISBN: 0-412-145618]
  • Sami Franssila, Introduction to microfabrication [ISBN: 9780470851067]
  • Schroder, Dieter 2006, Semiconductor Material and Device Characterisation, 3rd Ed., Wiley
Recommended Article/Paper Resources
This module does not have any other resources
 

Module Delivered in

Programme Code Programme Semester Delivery
TA_EAELE_B Bachelor Degree in Engineering (Honours) in Electronic Engineering 7 Elective
TA_EELEC_B Bachelor of Engineering (Honours) in Electronic Engineering -- Add On Year 1 Elective